Industry News

SMT Hybrid Packaging 2017: „Call for Tutorials” is launched

2016-07-14 10:23:57
With the “Call for Tutorials”, SMT Hybrid Packaging, International Exhibition and Conference for System Integration in Micro Electronics, gives the starting signal for the event year: as of now, users and experts from industry and academia are invited to submit their own personal contributions and innovative solutions for electronic assembly production.

Diverse content overview – fundamental topics in focus
A time slot of three hours is available for each tutorial speaker and can be organized independently or in cooperation with other speakers and companies. Tutorials convey sound and application oriented knowledge of one specific topic. Speakers benefit from a highly skilled expert audience and the direct exchange about new technologies, current research findings and future developments. Furthermore, they are offered an ideal platform to extend their network of international experts.

Next year, tutorials will have a special focus on fundamental topics. The committee under chairman Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM, specified the following topic areas:
  1. Interconnection technology
  2. Reliability and quality of assemblies
  3. New materials, material development, material efficiency
  4. Packaging and system integration, 3-D integration technologies
  5. Power electronics and high temperature assemblies
  6. Printed electronics, flex and rigid-flex assemblies
  7. Power LED systems and photonic boards
  8. Environment, energy efficiency, disposal
  9. Panel Level Packaging
  10. Automation, organization, optimization (Industry 4.0, IoT)
The deadline for the submission of tutorial abstracts is 4 October 2016. Further information regarding the terms and conditions, the selection procedure and the submission form is available online at
Application oriented and industry-related

Besides the tutorials, the workshops and the conference of SMT Hybrid Packaging are application oriented, industry-related and consider themselves as an information and discussion platform for relevant challenges and solutions concerning the entire value chain of electronic assembly production.
System integration in micro electronics with a holistic approach
SMT Hybrid Packaging takes place from 16 – 18 May 2017 in Nuremberg, Germany, and is the only event in Europe which takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.