Selective soldering machine NP-350 ALL IN ONE - HB AUTOMATION | SMT Reflow soldering oven

Main parts:

1. Solder pot nozzle

2. With a 130-micron orifice controlled by micro drop jet flux sprayer ( Made in Germany)

3. Preheating zone with flashing quartz IR preheater.

System Benefits & Features
• Precise, accurate, reliable soldering of through-hole components in mixed boards with previously soldered SMT components;
• Reduce board processing time as compared with hand soldering;
• Reduce direct labor costs, decrease rework costs, increase consistency over hand soldering through-hole components;
• One, all inclusive system - Flux, Preheat, and Solder
• PC software interface for easy on instrument setup, programming and parameter control
• Instrument programming flexibility and control over preheat, temperature, soldering dwell times, location, direction, and more...
• Off-line programming with photos can and Gerber import software for convenient machine setup
• Variety of Nozzles available for flexibility - Wettable and Specialty Nozzles

• Lead-free compatible.

Specifications

Items	Description
Model	NP-350
Min.PCB size	L 50mm * W 50mm
Max.PCB size	L 300mm * W 300mm
PCB top side / bottom side clearance	Max.Upper 100mm and bottom 50mm
PCB process edge	>4mm
Boards handling system
Conveyor system	Chain conveyor
Conveyor heights	850+/-50mm
Width adjustment	60mm to 460mm
Width adjustment accuracy	+/-0.2mm
Position accuracy above fluxer, preheater,and solder nozzle	± 0.1mm (± 0.004”)
Conveyor direction	Left to right / right to left
Preheating system – Bottom side
Preheating temperature	Max.180°C (PCB surface)
Temperature control accuracy	+/-2°C@3 sigma/Cpk≥1.33
Heater	Philips Cesium light, independent control
Fluxing system
Fluxer nozzle	micro drop jet fluxer
Fluxing wet area	Ø2 mm to Ø5mm
flux types	alcohol or water based
Fluxing Controller	automatic level control with capacitive sensor
Selective position method	X-Y Platform
Position speed/ accuracy	Max.400mm/s , +/-0.25mm
Flux tank	3L Stainless Steel & Fittings,including Flux Level Montiorin
Soldering Unit for Soldering Processes
solder pot compatible for lead free soldering	Standard
Min. Neighbor Component Clearance*	1.5 - 3mm (0.06” - 0.12”)depending on nozzle type
nitrogen operation	Standard
automatic wave height and solder level control	Standard
automatic wire solder feeder	Standard
wettable and non-wettable quick change nozzles	Standard
solder bath temperature	300°C
Temperature control accuracy	+/-2°C@3 sigma/Cpk≥1.33
Solder pot capacity	12kg lead free
Wave heights	Max.5mm
Solder pot moving speed	Max.400mm/s
Soldering nozzle dimensions	Ø5 to Ø12mm (or customized)
Control system
PCB data import	GERB file, Offline file import, Image program
Programing interface	Windows interface
Power	220 VAC, 1Ø, 15A
Power max.consumption	2.5kW
Max. Fuse Rate	15A